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SAMSUNG ELECTRONICS CO., LTD. (삼성전자주식회사)
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Patent Application Publication 2024
Patent Application Publication 2023
Patent Application Publication 2022
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Application Publication 2024
Registration Publication 2024
Application Publication for Last 1 Week
Registration Publication for Last 1 Week
No. Publication Date Title of Invention IPC Application No. Application Date
1 2024-05-17 IMAGE PROCESSING METHOD FOR IMAGE CODING AND ELECTRONIC DEVICE FOR PERFORMING THE SAME (영상 코딩을 위한 영상 처리 방법 및 이를 수행하는 전자 장치) H04N 19/513, H04N 19/105, H04N 19/172, H04N 19/124, H04N 19/177, G06T 9/00, G06N 3/04 1020220147961 2022-11-08
2 2024-05-17 OVEN FOR OPERATING BASED ON A RISK LEVEL AND CONTROLLING METHOD THEREOF (위험도 레벨에 따라 동작하는 오븐 및 그의 제어 방법) F24C 3/12, F24C 7/08, F24C 15/04, E05F 15/40, E05F 15/70, G08B 21/02, G08B 3/10, G06V 40/10 1020220147997 2022-11-08
3 2024-05-17 SEMICONDUCTOR PACKAGE (반도체 패키지) H01L 25/065, H01L 23/00 1020220148407 2022-11-09
4 2024-05-17 CASCODE AMPLIFIER WITH IMPROVED AMPLIFICATION CHARACTERISTICS (증폭 특성이 개선된 캐스코드 증폭기) H03F 1/22, H03F 3/21, H03F 3/45 1020220148438 2022-11-09
5 2024-05-17 BRUSH FOR CLEANING A WAFER (웨이퍼 세정용 브러시) H01L 21/67, B08B 1/00 1020220148446 2022-11-09
6 2024-05-17 Electronic apparatus and control method thereof (전자 장치 및 그 제어 방법) H04N 9/31, H04N 21/422 1020220148475 2022-11-09
7 2024-05-17 APPARATUS FOR PREDICTING SECURITY REQUIREMENT AND SYSTEM INCLUDING THE SAME (보안 요구사항 예측을 위한 장치 및 이를 포함하는 시스템) G06F 21/57, G06F 40/205, G06F 40/247 1020220148517 2022-11-09
8 2024-05-17 SEMICONDUCTOR PACKAGE (반도체 패키지) H01L 25/10, H01L 23/00, H01L 25/18, H01L 23/31 1020220148604 2022-11-09
9 2024-05-17 Semiconductor memory device and operating method thereof (메모리 장치 및 그의 동작 방법) G11C 11/406, G11C 7/10, G11C 11/4076 1020220148607 2022-11-09
10 2024-05-17 PHOTOMASK MANUFACTURING METHOD AND A SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME (포토마스크 제작 방법 및 이를 이용한 반도체 장치 제조 방법) G03F 1/70, G03F 7/20, H10B 43/27 1020220148618 2022-11-09